? semiconductor components industries, llc, 2011 march, 2011 ? rev. 4 1 publication order number: cm1419/d cm1419 praetorian l-c emi filter with esd protection for headset speakers product description the cm1419 is an l ? c emi filter array with esd protection that integrates two pi ? filters (c ? l ? c) for a headset speaker. the cm1419 has component values of 117 pf/3.0 nh/117 pf. the parts include esd protection diodes on all input/output pins, and provide a very high level of protection for sensitive electronic components against possible electrostatic discharge (esd). the esd diodes connected to the filter ports safely dissipate esd strikes of 30 kv, which is beyond the maximum requirement of the iec61000 ? 4 ? 2 international standard. in accordance with mil ? std ? 883 (method 3015) specification for human body model (hbm) esd, the pins are protected for contact discharges at greater than 30 kv. this device is particularly well suited for portable electronics (e.g. mobile handsets, pdas, notebook computers) because of its small package format and easy ? to ? use pin assignments. in particular, the cm1419 is ideal for emi filtering and protecting speaker output lines of the headset speaker from esd in mobile handsets. most speakers have an impedance of 8 . however, to maximize the power output, the resistance of an emi filter needs to be as low as possible. the cm1419 addresses this by using a c ? l ? c based emi filter with an inductor having less than 0.35 of resistance. the cm1419 comes with optiguard coating resulting in improved reliability at assembly. the cm1419 is housed in a space saving, low profile chip scale package with rohs ? compliant, lead ? free finishing. features ? two channels of emi filtering ? 30 kv esd protection (iec 61000 ? 4 ? 2, contact discharge) ? 30 kv esd protection (hbm) ? optiguard coating for improved reliability at assembly ? greater than 30 db of attenuation at 1 ghz ? 5 ? bump, 1.590 mm x 1.220 mm footprint chip scale package (csp) ? these devices are pb ? free and are rohs compliant applications ? headset speaker port in mobile handsets ? i/o port protection for mobile handsets, notebook computers, pdas etc. ? emi filtering for data ports in cell phones, pdas or notebook computers marking diagram device package shipping ? ordering information http://onsemi.com cm1419 ? 02cp wlcsp5 (pb ? free) 3500/tape & reel ?for information on tape and reel specifications, including part orientation and tape sizes, please refer to our tape and reel packaging specification brochure, brd8011/d. wlcsp5 cp suffix case 567ba ch = cm1419 ? 02cp block diagram a1 117 pf 117 pf filter #1 filter #1 a3 3 nh b1 117 pf 117 pf filter #2 b3 filter #2 gnd b2 ch gnd a2 3 nh
cm1419 http://onsemi.com 2 table 1. pin descriptions pin name description a1 filter #1 filter #1 input a3 filter #1 filter #1 input c1 filter #2 filter #2 input c3 filter #2 filter #2 input b2 gnd device ground package/pinout diagrams top view (bumps down view) a bottom view (bumps up view) orientation marking orientation marking cm1419 wlcsp5 package c a1 a3 a1 123 + ch c1 c3 b2 b specifications table 2. absolute maximum ratings parameter rating units storage temperature range ? 65 to +150 c dc current per inductor 500 ma dc package power rating 0.5 w stresses exceeding maximum ratings may damage the device. maximum ratings are stress ratings only. functional operation above t he recommended operating conditions is not implied. extended exposure to stresses above the recommended operating conditions may af fect device reliability. table 3. standard operating conditions parameter rating units operating temperature range ?40 to +85 c table 4. electrical operating characteristics (note 1) symbol parameter conditions min typ max units l inductance 3.0 nh r dc channel resistance 0.28 0.35 c tot total channel capacitance 2.5 v dc, 1 mhz, 30 mv ac 187 234 281 pf c 1 capacitance c 1 2.5 v dc, 1 mhz, 30 mv ac 93 117 140 pf v st stand ? off voltage i = 10 a 6.0 v i leak diode leakage current v in = 3.3 v 0.1 1.0 a v sig signal clamp voltage positive clamp negative clamp i load = 10 ma i load = ? 10 ma 5.6 ? 9.0 6.8 ? 6.8 9.0 ? 5.6 v v esd in ? system esd withstand voltage a) human body model, mil ? std ? 883, method 3015 b) contact discharge per iec 61000 ? 4 ? 2 level 4 (note 2) 30 30 kv r dyn dynamic resistance positive negative 0.95 0.90 f c cut ? off frequency, z source = 50 , z load = 50 l = 3 nh, c = 117 pf 22 mhz 1. t a = 25 c unless otherwise specified. 2. esd applied to input and output pins with respect to gnd, one at a time.
cm1419 http://onsemi.com 3 performance information typical filter performance (nominal conditions unless specified otherwise, 50 environment) figure 1. insertion loss vs. frequency (filter #1 to gnd b2) frequency (mhz) insertion loss (db) 3 10 100 1000 6000 ? 50 ? 45 ? 40 ? 35 ? 30 ? 25 ? 20 ? 15 ? 10 ? 5 figure 2. insertion loss vs. frequency (filter #2 to gnd b2) frequency (mhz) insertion loss (db) 3 10 100 1000 6000 ? 50 ? 45 ? 40 ? 35 ? 30 ? 25 ? 20 ? 15 ? 10 ? 5
cm1419 http://onsemi.com 4 performance information (cont?d) figure 3. typical diode capacitance vs. input voltage (normalized to 2.5 v dc)
cm1419 http://onsemi.com 5 application information parameter value pad size on pcb 0.240 mm pad shape round pad definition non ? solder mask defined pads solder mask opening 0.290 mm round solder stencil thickness 0.125 mm ? 0.150 mm solder stencil aperture opening (laser cut, 5% tapered walls) 0.300 mm round solder flux ratio 50/50 by volume solder paste type no clean pad protective finish osp (entek cu plus 106a) tolerance ? edge to corner ball 50 m solder ball side coplanarity 20 m maximum dwell time above liquidous 60 seconds maximum soldering temperature for lead ? free devices using a lead ? free solder paste 260 c figure 4. recommended non ? solder mask defined pad illustration non ? solder mask defined pad 0.240 mm dia. solder stencil opening 0.300 mm dia. solder mask opening 0.290 mm dia. figure 5. lead ? free (snagcu) solder ball reflow profile 200 250 150 100 50 0 1:00.0 2:00.0 3:00.0 4:00.0 time (minutes) temperature ( c)
cm1419 http://onsemi.com 6 package dimensions wlcsp5, 1.59x1.22 case 567ba ? 01 issue o seating plane 0.05 c notes: 1. dimensioning and tolerancing per asme y14.5m, 1994. 2. controlling dimension: millimeters. 3. coplanarity applies to spherical crowns of solder balls. 2x dim a min max 0.56 millimeters a1 d 1.59 bsc e b 0.29 0.35 ed 0.435 bsc 0.72 d e a b pin a1 reference ed a 0.05 b c 0.03 c 0.05 c 5x b 12 3 c b a 0.05 c a a1 a2 c 0.21 0.27 1.22 bsc ee 0.50 bsc pitch 0.25 5x dimensions: millimeters *for additional information on our pb ? free strategy and soldering details, please download the on semiconductor soldering and mounting techniques reference manual, solderrm/d. soldering footprint* 0.25 0.44 0.05 c 2x top view side view bottom view note 3 ee/2 a2 0.40 ref recommended a1 package outline 0.44 ee pitch 0.50 optiguard option on semiconductor and are registered trademarks of semiconductor components industries, llc (scillc). scillc reserves the right to mak e changes without further notice to any products herein. scillc makes no warranty, representation or guarantee regarding the suitability of its products for an y particular purpose, nor does scillc assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including wi thout limitation special, consequential or incidental damages. ?typical? parameters which may be provided in scillc data sheets and/or specifications can and do vary in different application s and actual performance may vary over time. all operating parameters, including ?typicals? must be validated for each customer application by customer?s technical experts. scillc does not convey any license under its patent rights nor the rights of others. scillc products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the scillc product could create a sit uation where personal injury or death may occur. should buyer purchase or use scillc products for any such unintended or unauthorized application, buyer shall indemnify and hold scillc and its of ficers, employees, subsidiaries, af filiates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, direct ly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that scillc was negligent regarding the design or manufacture of the part. scillc is an equal opportunity/affirmative action employer. this literature is subject to all applicable copyright laws and is not for resale in any manner. publication ordering information n. american technical support : 800 ? 282 ? 9855 toll free usa/canada europe, middle east and africa technical support: phone: 421 33 790 2910 japan customer focus center phone: 81 ? 3 ? 5773 ? 3850 cm1419/d praetorian and optiguard are trademarks of semiconductor components industries, llc (scillc). literature fulfillment : literature distribution center for on semiconductor p.o. box 5163, denver, colorado 80217 usa phone : 303 ? 675 ? 2175 or 800 ? 344 ? 3860 toll free usa/canada fax : 303 ? 675 ? 2176 or 800 ? 344 ? 3867 toll free usa/canada email : orderlit@onsemi.com on semiconductor website : www.onsemi.com order literature : http://www.onsemi.com/orderlit for additional information, please contact your local sales representative
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